Thermal Drying, Photo imageable, aqueous develop.
Scatter light type exposure units can be used.
Excellent adhesion and is suitable for use on a wide range of metals (stainless steel, brass, etc).
Only suitable for acid etch (Ferric Chloride is recommended).
Less Preclean steps required than traditional PCM products.
Excellent chemical resistance which allows long etch dwell times in excess of 1hour for certain industries, however please note longer dwell times (in excess of 45minutes) may require thicker DFT. This will lower the resolution achievable.
Offers faster, cleaner etch than traditional PCM products.
Fast stripping (faster than XV750 screen print versions above). The dry resist may be stripped in a solution of 3% potassium hydroxide (sodium hydroxide can also be used).
Normal print thickness is 6-8µm DFT, although this is strongly dependent on extraction speed and resist viscosity.
Resolution of below 50µm is usually achievable (resolution is always dependant not just on the etch resist but customers develop & etch capability and production environment – clean room class 10,000 is recommended).
Reasonable photospeed (200-250mJ/cm2).
Single pack system with good shelf life. Available in dark blue colour only.
This product is subject to a minimum order restriction.

CKXN0146 Imageline Etch Resist