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XZ612 SCREENFLEX THERMAL CURING COVERLAY
Screenflex is a new high solids screen defined flexible coverlay.It is primarily designed to act as a dielectric & protective layer for simple flex to fit circuits.


It is highly suited to use on polyimide/copper circuits. The thermal cure of the product makes it robust enough to withstand HASL process and most ENIG chemistries. It should be noted that the temperature required for curing might make Screenflex unsuitable for use with untreated polyester (or other heat sensitive substrates).

CBSN2045 Screenflex Dark Green Resist
CBSN2052 Screenflex Yellow Resist
CBSN2048 Screenflex Black Resist
CCSN3010 XZ17B Catalyst

(click on part number for technical information)
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