Imageflex is a flexible thermal curing two-pack LPISM for application by spray or screen. It dries by evaporation to give an aqueous developing flexible solder mask.

Imageflex has been developed for use on flexible circuits where a traditional LPISM could not be used (due to their brittle nature). Flexible circuits previously would have been manufactured by encapsulation top & bottom in a sandwich of Capton (or similar treated polyimide substrate).

Imageflex can replace the top layer of Capton.

Imageflex offers easier production and cost savings due to its photoimageable properties, compared to the cost of tooling jigs and/or laser ablation process to produce Capton encapsulated circuits.

Imageflex is ideally suited to circuits requiring metallization after application of the mask.It is suitable for use with HASL, ENIG, Immersion Gold and Immersion Tin.

Imageflex offers excellent resolution (capable of 50µ track & Gap). Flexibility greatly exceeds IPC SM840C.

Imageflex Passes UL94VO Rating (File No. E83564).

XV601T IMAGEFLEX SOLDERMASK
Product Code	Description	Pack Size (KG)	Pack Code	TIL #
XV601T	Imageflex Spray Flexible Soldermask (Orange resist)	10	CAWN1276	T052
XV601T	Imageflex Spray Flexible Soldermask (Clear Hardener for spray XV601T)	5	CAWN1277	T052
XV601T	Imageflex Screen Flexible Soldermask (Green G1 Screen Resist Component)	0.67	CAWN1163	T017
XV601T	Imageflex Screen Flexible Soldermask (BLACK G1 Screen Resist Component)	0.67	CAWN1163	T0BC
XV601T	Imageflex Screen Flexible Soldermask (Clear Hardener for G1 resists)	0.33	CAWN1164	T017

(click on technical info number for technical information)