Uses include:
Plating resist (will withstand most common plating solutions including gold)
Solder resist (will withstand wave soldering, HASL and reflow process),
Protective coating over PTF (conductive ink) fingers, switches & conductors during soldering- prevents flux from penetrating the film and altering Resistivity.
Protect gold fingers and gold switches during wave or HAL soldering.
Protection of SMT pads prior to component insertion.
Protection of specific PTH during either etching or soldering process
Suitable for use on flexible circuits provided the base laminate can withstand the cure temperature..
Also used as a resist during glass etching process.

Benefits of this product are:
a wide predry window
fast drying (10-15minutes @ 150OC recommended)
good peelability.
good chemical resistance
good solder resistance (should withstand 3 passes wave solder at 260OC)
able to cover 3-4mm diameter holes depending on screen set up and board thickness (5mm can be achieved with careful processing)