Recommended for single or multi-layer “additive” circuits on rigid substrates. UV curing gives crosslinked stable films without the evolution of VOC's. The recommended curing cycle is 2000 - 4000mJ/cm². It is essential that the ink is fully cured to ensure that subsequent processes, such as overprinting, have a minimal effect on the electrical properties.

It should be noted that XV800 series inks are not directly solderable. This is achieved by printing and curing a proprietary thermal curing copper ink onto the top layer of XV800 to produce solder pads.

For technical information leaflet please click here XV800