Company Information
Product Information
Technical
UL Listing
Industry Links
Contacts
News
Exhibitions and Seminars
Advertising
Circuits home page

Flexible coverlays

PACK CODE
PRODUCT/TECHNICAL
INFORMATION LEAFLET
FEATURES & ADVANTAGES
Thermal Curing Coverlays
CBSN2045 SCREENFLEX GREEN 0.67kg Screenflex is a new high solids flexible coverlay for application by screen printing to flexible substrates. It is primarily designed to act as a dielectric on polymide/copper in simple flex to fit circuits.
CKXN0140 SCREENFLEX YELLOW 0.67kg
CBSN2048 SCREENFLEX BLACK 0.67kg
CCSN3010 XZ17B CATALYST 0.33kg
UV Coverlay
CFSN6032 UV600

 

GREEN
5kg

 

UV curing coverlay suitable for copper boards and flexible circuits, giving fast printing and curing properties combined with excellent dielectric properties.
ImageflexTM
CAWN1163


CAWN1164

XV601T IMAGEFLEXâ
RESIST

XV601T IMAGEFLEXâ

0.67kg



0.33kg
Imageflexâis a flexible thermal curing two-pack liquid photoimageable solder mask that can be either screen or spray applied and dries by evaporation to give an aqueous processable flexible coverlay. An Imageflex version is available for disk drive applications.